74HC00DB,118 NXP SemiconductorsBuy Now Datasheet |
MC74HC132AN Freescale SemiconductorBuy Now Datasheet |
Rohs Code | Yes | No |
---|---|---|
Part Life Cycle Code | Transferred | Obsolete |
Ihs Manufacturer | NXP SEMICONDUCTORS | MOTOROLA SEMICONDUCTOR PRODUCTS |
Part Package Code | SSOP1 | |
Package Description | SSOP-14 | DIP, DIP14,.3 |
Pin Count | 14 | |
Manufacturer Package Code | SOT337-1 | |
Reach Compliance Code | compliant | unknown |
HTS Code | 8542.39.00.01 | |
Family | HC/UH | |
JESD-30 Code | R-PDSO-G14 | R-PDIP-T14 |
JESD-609 Code | e4 | e0 |
Length | 6.2 mm | |
Load Capacitance (CL) | 50 pF | 50 pF |
Logic IC Type | NAND GATE | NAND GATE |
Max I(ol) | 0.004 A | 0.004 A |
Moisture Sensitivity Level | 1 | |
Number of Functions | 4 | |
Number of Inputs | 2 | |
Number of Terminals | 14 | 14 |
Operating Temperature-Max | 125 °C | 125 °C |
Operating Temperature-Min | -40 °C | -55 °C |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Code | SSOP | DIP |
Package Equivalence Code | SSOP14,.3 | DIP14,.3 |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE, SHRINK PITCH | IN-LINE |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 27 ns | 38 ns |
Propagation Delay (tpd) | 135 ns | |
Qualification Status | Not Qualified | Not Qualified |
Schmitt Trigger | NO | YES |
Seated Height-Max | 2 mm | |
Supply Voltage-Max (Vsup) | 6 V | |
Supply Voltage-Min (Vsup) | 2 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | NO |
Technology | CMOS | CMOS |
Temperature Grade | AUTOMOTIVE | MILITARY |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
Terminal Form | GULL WING | THROUGH-HOLE |
Terminal Pitch | 0.65 mm | 2.54 mm |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5.3 mm | |
Base Number Matches | 2 | 5 |
Power Supplies | 2/6 V | |