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74HC00DB,118 vs MM74HC132N feature comparison

74HC00DB,118 NXP Semiconductors

Buy Now Datasheet

MM74HC132N Rochester Electronics LLC

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1 DIP
Package Description SSOP-14 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-14
Pin Count 14 14
Manufacturer Package Code SOT337-1
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e3
Length 6.2 mm 19.18 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260 NOT APPLICABLE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 125 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT APPLICABLE
Width 5.3 mm 7.62 mm
Base Number Matches 2 4
Pbfree Code No

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