74HC00DB vs 74HC00D/N,118 feature comparison

74HC00DB NXP Semiconductors

Buy Now Datasheet

74HC00D/N,118 Nexperia

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SSOP SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 3 2
Manufacturer Package Code SOT108-1

Compare 74HC00DB with alternatives