74HC00DB-T vs MC74HC03AFR2 feature comparison

74HC00DB-T NXP Semiconductors

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MC74HC03AFR2 Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code SSOP SOIC
Package Description SSOP, SSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 135 ns 180 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Output Characteristics OPEN-DRAIN

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