74HC00N,652 vs 8403701CA feature comparison

74HC00N,652 NXP Semiconductors

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8403701CA Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14 ,
Pin Count 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14
JESD-609 Code e4
Length 19.025 mm 8.89 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Packing Method BULK
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.2 mm 2.03 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 8.89 mm
Base Number Matches 1 5
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE

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