74HC00N,652 vs MC74HC00AFEL feature comparison

74HC00N,652 NXP Semiconductors

Buy Now Datasheet

MC74HC00AFEL Rochester Electronics LLC

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIP SOIC
Package Description 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14 EIAJ, SO-14
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e4
Length 19.025 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method BULK
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 110 ns
Qualification Status Not Qualified COMMERCIAL
Schmitt Trigger NO
Seated Height-Max 4.2 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.275 mm
Base Number Matches 1 2
Pbfree Code Yes
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare 74HC00N,652 with alternatives