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74HC00N,652 vs TC74HC132AFN-ELP feature comparison

74HC00N,652 NXP Semiconductors

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.025 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method BULK PACK TAPE AND REEL
Peak Reflow Temperature (Cel) 260 240
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 27 ns 28 ns
Propagation Delay (tpd) 135 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 4.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL/PALLADIUM/GOLD (NI/PD/AU) TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code No
JESD-609 Code e0

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Compare TC74HC132AFN-ELP with alternatives

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