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74HC00N vs 74HC00D/G,118 feature comparison

74HC00N Philips Semiconductors

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74HC00D/G,118 Nexperia

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code unknown
JESD-30 Code R-PDIP-T14
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Packing Method TUBE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Surface Mount NO
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Base Number Matches 2 2
Part Package Code SOIC
Pin Count 14
Manufacturer Package Code SOT108-1

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