74HC02DB,112 vs MC74HC02AFR1 feature comparison

74HC02DB,112 NXP Semiconductors

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MC74HC02AFR1 Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1 SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 EIAJ, SOIC-14
Pin Count 14 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 27 ns 110 ns
Qualification Status Not Qualified COMMERCIAL
Schmitt Trigger NO
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Pbfree Code Yes

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