74HC03DB%2C118
vs
74HC03DB
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Not Recommended
|
| Ihs Manufacturer |
|
NEXPERIA
|
| Package Description |
|
SSOP,
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.39.00.01
|
| Date Of Intro |
|
2017-02-01
|
| Family |
|
HC/UH
|
| JESD-30 Code |
|
R-PDSO-G14
|
| JESD-609 Code |
|
e4
|
| Length |
|
6.2 mm
|
| Logic IC Type |
|
NAND GATE
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
145 ns
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
5.3 mm
|
| Base Number Matches |
|
2
|
|
|
|
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