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74HC03DB,112 vs 74HC00N,652 feature comparison

74HC03DB,112 Nexperia

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74HC00N,652 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SSOP1 DIP
Package Description SSOP-14 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count 14 14
Manufacturer Package Code SOT337-1 SOT27-1
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4
Length 6.2 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 145 ns 135 ns
Seated Height-Max 2 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 7.62 mm
Base Number Matches 2 1
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK PACK
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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