Findchips: Compare 74HC03DB,112 vs HD74HC132P

74HC03DB,112 vs HD74HC132P feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	HITACHI LTD
Part Package Code	SSOP1	DIP
Package Description	SOT-337-1, SSOP-14	DIP, DIP14,.3
Pin Count	14	14
Manufacturer Package Code	SOT337-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDIP-T14
JESD-609 Code	e4
Length	6.2 mm	19.2 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Moisture Sensitivity Level	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SSOP	DIP
Package Equivalence Code	SSOP14,.3	DIP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, SHRINK PITCH	IN-LINE
Packing Method	BULK	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	29 ns	25 ns
Propagation Delay (tpd)	29 ns	125 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	YES
Seated Height-Max	2 mm	5.06 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	4.5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	0.65 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	5.3 mm	7.62 mm
Base Number Matches	2	2
	Logic » Gates	Logic » Gates