74HC03DB,118 vs MM74HC00SJ feature comparison

74HC03DB,118 NXP Semiconductors

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MM74HC00SJ Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1 SOIC
Package Description SOT-337-1, SSOP-14 5.30 MM, LEAD FREE, EIAJ TYPE2, SOP-14
Pin Count 14 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 6.2 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 29 ns 113 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 3
Pbfree Code Yes

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