74HC03DB-T vs 5962-8403701VCA feature comparison

74HC03DB-T NXP Semiconductors

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5962-8403701VCA Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SSOP DIP
Package Description SSOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm 19.94 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 29 ns 135 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 2 1
ECCN Code EAR99
Additional Feature LG-MAX
Max I(ol) 0.0052 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Screening Level MIL-PRF-38535 Class V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74HC03DB-T with alternatives

Compare 5962-8403701VCA with alternatives