74HC03DB-T vs MM74HCT00M feature comparison

74HC03DB-T NXP Semiconductors

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MM74HCT00M Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SSOP SOIC
Package Description SSOP, 0.150 INCH, MS-012, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Length 6.2 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 3.9 mm
Base Number Matches 2 5
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
ECCN Code EAR99
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

Compare 74HC03DB-T with alternatives

Compare MM74HCT00M with alternatives