74HC03DB-T vs TC74HC00AFN-ELP feature comparison

74HC03DB-T Nexperia

Buy Now Datasheet

TC74HC00AFN-ELP Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEXPERIA TOSHIBA CORP
Package Description SSOP, SOP,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 145 ns 19 ns
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
Part Package Code SOIC
Pin Count 14
Load Capacitance (CL) 50 pF
Qualification Status Not Qualified

Compare 74HC03DB-T with alternatives

Compare TC74HC00AFN-ELP with alternatives