74HC05PW
vs
HD74HC05FP
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HITACHI LTD
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
SOP, SOP14,.3
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
|
Length |
5 mm
|
10.06 mm
|
Logic IC Type |
INVERTER
|
INVERTER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
135 ns
|
115 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
Width |
4.4 mm
|
5.5 mm
|
Base Number Matches |
5
|
2
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
SOP14,.3
|
Prop. Delay@Nom-Sup |
|
23 ns
|
Schmitt Trigger |
|
NO
|
|
|
|
Compare 74HC05PW with alternatives
Compare HD74HC05FP with alternatives