74HC08D vs 74HC08D,652 feature comparison

74HC08D Philips Semiconductors

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74HC08D,652 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE TUBE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 2
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MO-012, SOT-108-1, SO-14
Pin Count 14
Manufacturer Package Code SOT108-1
ECCN Code EAR99
Samacsys Manufacturer NXP
Family HC/UH
Length 8.65 mm
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 135 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

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