74HC112DB-T vs TC74HC173AF-EL feature comparison

74HC112DB-T NXP Semiconductors

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TC74HC173AF-EL Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SSOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 2 4
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 265 ns 195 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 24 MHz 40 MHz
Base Number Matches 1 3
Max Frequency@Nom-Sup 34000000 Hz
Max I(ol) 0.0078 A
Output Characteristics 3-STATE
Package Equivalence Code SOP16,.3
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 39 ns

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