74HC132D,652 vs MC74HC03AF feature comparison

74HC132D,652 NXP Semiconductors

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MC74HC03AF onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description SOT-108-1, SO-14 SSOP,
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 31 ns
Propagation Delay (tpd) 38 ns 180 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 5.3 mm
Base Number Matches 2 1
kg CO2e/kg 12.4
Average Weight (mg) 151.15
CO2e (mg) 1874.26
Output Characteristics OPEN-DRAIN

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