74HC132D/T3 vs M74HCT132B1R feature comparison

74HC132D/T3 NXP Semiconductors

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M74HCT132B1R STMicroelectronics

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e4
Length 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 38 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 45 ns
Schmitt Trigger YES

Compare 74HC132D/T3 with alternatives

Compare M74HCT132B1R with alternatives