74HC132D-T vs TC74HC132AFN feature comparison

74HC132D-T Philips Semiconductors

Buy Now Datasheet

TC74HC132AFN Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 31 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Additional Feature NOT AVAILABLE IN JAPAN
Family HC/UH
Length 8.65 mm
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 140 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

Compare TC74HC132AFN with alternatives