74HC132DB%2C118
vs
74HC03DB
feature comparison
Rohs Code |
|
Yes
|
Part Life Cycle Code |
|
Not Recommended
|
Ihs Manufacturer |
|
NEXPERIA
|
Package Description |
|
SSOP,
|
Reach Compliance Code |
|
compliant
|
HTS Code |
|
8542.39.00.01
|
Date Of Intro |
|
2017-02-01
|
Family |
|
HC/UH
|
JESD-30 Code |
|
R-PDSO-G14
|
JESD-609 Code |
|
e4
|
Length |
|
6.2 mm
|
Logic IC Type |
|
NAND GATE
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
OPEN-DRAIN
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SSOP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Propagation Delay (tpd) |
|
145 ns
|
Seated Height-Max |
|
2 mm
|
Supply Voltage-Max (Vsup) |
|
6 V
|
Supply Voltage-Min (Vsup) |
|
2 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.65 mm
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
5.3 mm
|
Base Number Matches |
|
2
|
|
|
|
Compare 74HC03DB with alternatives