74HC132DB,118 vs 74HC132D feature comparison

74HC132DB,118 NXP Semiconductors

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74HC132D Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP1
Package Description SOT-337-1, SSOP-14 SOIC-14
Pin Count 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 149.35
CO2e (mg) 1851.94
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 6.2 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP14,.3 SOP14,.23
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 38 ns
Propagation Delay (tpd) 38 ns 160 ns
Qualification Status Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 3.9 mm
Base Number Matches 2 4
Factory Lead Time 20 Weeks
Date Of Intro 2016-05-25
Samacsys Manufacturer Toshiba
Power Supply Current-Max (ICC) 50 mA

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