74HC132DB,118 vs CD74HCT00EX feature comparison

74HC132DB,118 NXP Semiconductors

Buy Now Datasheet

CD74HCT00EX RCA

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS RCA SOLID STATE
Part Package Code SSOP1
Package Description SOT-337-1, SSOP-14 DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 149.35 1630.6
CO2e (mg) 1851.94 20219.441
Family HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns 30 ns
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 2 3

Compare 74HC132DB,118 with alternatives