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74HC132DB,118 NXP SemiconductorsBuy Now Datasheet |
DV74HC00AD avg SemiconductorsBuy Now Datasheet |
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | Obsolete |
Ihs Manufacturer | NXP SEMICONDUCTORS | AVG SEMICONDUCTORS |
Part Package Code | SSOP1 | SOIC |
Package Description | SSOP, SSOP14,.3 | SOP, SOP14(UNSPEC) |
Pin Count | 14 | 14 |
Manufacturer Package Code | SOT337-1 | |
Reach Compliance Code | compliant | unknown |
HTS Code | 8542.39.00.01 | 8542.39.00.01 |
Family | HC/UH | HC/UH |
JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 Code | e4 | |
Length | 6.2 mm | 8.65 mm |
Load Capacitance (CL) | 50 pF | 50 pF |
Logic IC Type | NAND GATE | NAND GATE |
Max I(ol) | 0.004 A | 0.004 A |
Moisture Sensitivity Level | 1 | |
Number of Functions | 4 | 4 |
Number of Inputs | 2 | 2 |
Number of Terminals | 14 | 14 |
Operating Temperature-Max | 125 °C | 125 °C |
Operating Temperature-Min | -40 °C | -55 °C |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Code | SSOP | SOP |
Package Equivalence Code | SSOP14,.3 | SOP14(UNSPEC) |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
Packing Method | TAPE AND REEL | |
Peak Reflow Temperature (Cel) | 260 | |
Power Supplies | 2/6 V | 2/6 V |
Prop. Delay@Nom-Sup | 38 ns | 110 ns |
Propagation Delay (tpd) | 38 ns | 110 ns |
Qualification Status | Not Qualified | Not Qualified |
Schmitt Trigger | YES | NO |
Seated Height-Max | 2 mm | 1.75 mm |
Supply Voltage-Max (Vsup) | 6 V | 6 V |
Supply Voltage-Min (Vsup) | 2 V | 2 V |
Supply Voltage-Nom (Vsup) | 5 V | 4.5 V |
Surface Mount | YES | YES |
Technology | CMOS | CMOS |
Temperature Grade | AUTOMOTIVE | MILITARY |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | GULL WING |
Terminal Pitch | 0.65 mm | 1.27 mm |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5.3 mm | 3.9 mm |
Base Number Matches | 2 | 1 |