74HC132DB vs M38510/65001BCA feature comparison

74HC132DB NXP Semiconductors

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M38510/65001BCA Texas Instruments

Buy Now Datasheet
Source Content uid 74HC132DB M38510/65001BCA
Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Part Package Code SSOP DIP
Package Description SSOP, SSOP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 6.2 mm 19.94 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TUBE TUBE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 31 ns 21 ns
Propagation Delay (tpd) 38 ns 135 ns
Qualification Status Not Qualified Qualified
Schmitt Trigger YES NO
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm 7.62 mm
Base Number Matches 2 3
Factory Lead Time 6 Weeks
Additional Feature LG-MAX
Power Supply Current-Max (ICC) 0.01 mA
Screening Level MIL-M-38510 Class B

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