74HC132DR2G vs GD54HC132J feature comparison

74HC132DR2G Rochester Electronics LLC

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GD54HC132J LG Semicon Co Ltd

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
Family HC/UH
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e3 e0
Length 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 190 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 36 ns
Schmitt Trigger YES