74HC132NB vs 74HC03DB feature comparison

74HC132NB NXP Semiconductors

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74HC03DB Nexperia

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description DIP, SSOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 149.35
CO2e (mg) 20219.441 1851.94
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.025 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 38 ns 145 ns
Qualification Status Not Qualified
Seated Height-Max 4.2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.3 mm
Base Number Matches 1 2
Rohs Code Yes
Date Of Intro 2017-02-01
JESD-609 Code e4
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

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