74HC132NB vs CD74HCT00E feature comparison

74HC132NB NXP Semiconductors

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CD74HCT00E General Electric Solid State

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS GENERAL ELECTRIC SOLID STATE
Package Description DIP, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 7
Rohs Code No
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 30 ns
Schmitt Trigger NO

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