74HC132NB vs MC74HC132ADR2 feature comparison

74HC132NB NXP Semiconductors

Buy Now Datasheet

MC74HC132ADR2 Motorola Mobility LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description DIP, SOP, SOP14,.25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 151.15
CO2e (mg) 20219.441 1874.26
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.025 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 38 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 5
Part Package Code SOIC
Pin Count 14
JESD-609 Code e0
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)

Compare 74HC132NB with alternatives

Compare MC74HC132ADR2 with alternatives