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74HC132PW,118 NexperiaBuy Now Datasheet |
GD74HC132 LG Semicon Co LtdBuy Now Datasheet |
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| Source Content uid | 74HC132PW,118 | |
| Part Life Cycle Code | Active | Obsolete |
| Part Package Code | TSSOP | |
| Package Description | TSSOP, | DIP, DIP14,.3 |
| Pin Count | 14 | |
| Manufacturer Package Code | SOT402-1 | |
| Reach Compliance Code | compliant | unknown |
| HTS Code | 8542.39.00.01 | 8542.39.00.01 |
| Date Of Intro | 1993-09-01 | |
| Family | HC/UH | |
| JESD-30 Code | R-PDSO-G14 | R-PDIP-T14 |
| JESD-609 Code | e4 | e0 |
| Length | 5 mm | |
| Load Capacitance (CL) | 50 pF | 50 pF |
| Logic IC Type | NAND GATE | NAND GATE |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Inputs | 2 | |
| Number of Terminals | 14 | 14 |
| Operating Temperature-Max | 125 °C | 85 °C |
| Operating Temperature-Min | -40 °C | -40 °C |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Code | TSSOP | DIP |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
| Peak Reflow Temperature (Cel) | 260 | |
| Propagation Delay (tpd) | 38 ns | |
| Qualification Status | Not Qualified | Not Qualified |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 6 V | |
| Supply Voltage-Min (Vsup) | 2 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | NO |
| Technology | CMOS | CMOS |
| Temperature Grade | AUTOMOTIVE | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING | THROUGH-HOLE |
| Terminal Pitch | 0.65 mm | 2.54 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm | |
| Base Number Matches | 2 | 2 |
| Rohs Code | No | |
| Max I(ol) | 0.004 A | |
| Package Equivalence Code | DIP14,.3 | |
| Power Supplies | 2/6 V | |
| Prop. Delay@Nom-Sup | 30 ns | |
| Schmitt Trigger | YES | |
