Findchips: Compare 74HC132PW,132 vs M38510/65005BCA

74HC132PW,132 vs M38510/65005BCA feature comparison

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Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TELEDYNE E2V (UK) LTD
Package Description	TSSOP,	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-GDIP-T14
Length	5 mm
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
Package Code	TSSOP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
Propagation Delay (tpd)	38 ns	29 ns
Seated Height-Max	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	4.5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	MILITARY
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	0.65 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm
Base Number Matches	1	1
Part Package Code		DIP
Pin Count		14
JESD-609 Code		e0
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Prop. Delay@Nom-Sup		29 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Screening Level		MIL-M-38510 Class B
Terminal Finish		TIN LEAD
	Logic » Gates	Logic » Gates