Findchips: Compare 74HC132PW,132 vs M74HC132F1

74HC132PW,132 vs M74HC132F1 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	STMICROELECTRONICS
Package Description	TSSOP,	DIP, DIP14,.3
Reach Compliance Code	unknown	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-GDIP-T14
Length	5 mm
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
Package Code	TSSOP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE
Propagation Delay (tpd)	38 ns	31 ns
Seated Height-Max	1.1 mm	5 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	0.65 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	7.62 mm
Base Number Matches	1	1
Pbfree Code		No
Rohs Code		No
Part Package Code		DIP
Pin Count		14
JESD-609 Code		e0
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Prop. Delay@Nom-Sup		31 ns
Qualification Status		Not Qualified
Schmitt Trigger		YES
Terminal Finish		TIN LEAD
	Logic » Gates	Logic » Gates