74HC132PW,132 vs MM54HC132J/883 feature comparison

74HC132PW,132 NXP Semiconductors

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MM54HC132J/883 Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Package Description TSSOP, DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 5 mm 19.43 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 38 ns 37 ns
Seated Height-Max 1.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Qualification Status Not Qualified
Schmitt Trigger YES
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

Compare 74HC132PW,132 with alternatives

Compare MM54HC132J/883 with alternatives