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74HC132PW-Q100,118 vs 5962-8984502VCA feature comparison

74HC132PW-Q100,118 NXP Semiconductors

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5962-8984502VCA Defense Supply Center Columbus

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS DEFENSE SUPPLY CENTER COLUMBUS
Part Package Code TSSOP DIP
Package Description TSSOP, TSSOP14,.25 DIP,
Pin Count 14 14
Manufacturer Package Code SOT402-1
Reach Compliance Code compliant unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 5 mm 19.56 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TAPE AND REEL
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 38 ns
Propagation Delay (tpd) 190 ns 186 ns
Qualification Status Not Qualified Qualified
Schmitt Trigger YES
Screening Level AEC-Q100 MIL-PRF-38535 Class V
Seated Height-Max 1.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4.4 mm 7.62 mm
Base Number Matches 2 3
HTS Code 8542.39.00.01
JESD-609 Code e0
Peak Reflow Temperature (Cel) NOT APPLICABLE
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE

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