74HC132PW-Q100,118 vs 74HC03DB,118 feature comparison

74HC132PW-Q100,118 NXP Semiconductors

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74HC03DB,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SSOP1
Package Description 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 SOT-337-1, SSOP-14
Pin Count 14 14
Manufacturer Package Code SOT402-1 SOT337-1
Reach Compliance Code compliant compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Equivalence Code TSSOP14,.25 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 38 ns 29 ns
Propagation Delay (tpd) 190 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 5.3 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
JESD-609 Code e4
Output Characteristics OPEN-DRAIN
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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