74HC138D,653
vs
M74HC138RM13TR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Part Package Code |
SOP
|
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT109-1
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
3 ENABLE INPUTS
|
|
| Family |
HC/UH
|
|
| Input Conditioning |
STANDARD
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e4
|
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
45 ns
|
|
| Propagation Delay (tpd) |
225 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
|
|
|
|
Compare 74HC138D,653 with alternatives