74HC138D/T3 vs M74HC138RM13TR feature comparison

74HC138D/T3 NXP Semiconductors

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M74HC138RM13TR STMicroelectronics

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS 3 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 9.9 mm 9.9 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 225 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer STMicroelectronics
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Packing Method TR
Prop. Delay@Nom-Sup 38 ns

Compare 74HC138D/T3 with alternatives

Compare M74HC138RM13TR with alternatives