74HC138D
vs
935298742115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NEXPERIA
|
| Package Description |
SOIC-16
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
53 Weeks, 1 Day
|
|
| Date Of Intro |
2016-05-25
|
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
HC/UH
|
HC/UH
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G16
|
R-PQCC-N16
|
| Length |
9.9 mm
|
3.5 mm
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Propagation Delay (tpd) |
225 ns
|
225 ns
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3.9 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR, 7 INCH
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare 74HC138D with alternatives
Compare 935298742115 with alternatives