74HC14BQ,115
vs
74HC14BQ-Q100,115
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
DHVQFN-14
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT762-1
|
SOT762-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Nexperia
|
Nexperia
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PQCC-N14
|
R-PQCC-N14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR, 7 INCH
|
TR, 7 INCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
190 ns
|
190 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.5 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare 74HC14BQ,115 with alternatives
Compare 74HC14BQ-Q100,115 with alternatives