74HC154N,652 vs 74AC138MTR feature comparison

74HC154N,652 NXP Semiconductors

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74AC138MTR STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code DIP SOIC
Package Description DIP, DIP24,.3 SO-16
Pin Count 24 16
Manufacturer Package Code SOT101-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Additional Feature 2 ENABLE INPUTS
Family HC/UH AC
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T24 R-PDSO-G16
JESD-609 Code e3 e3
Length 31.7 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.012 A
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 45 ns 14 ns
Propagation Delay (tpd) 225 ns 15.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish TIN TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 3.9 mm
Base Number Matches 1 1
ECCN Code EAR99
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260

Compare 74HC154N,652 with alternatives

Compare 74AC138MTR with alternatives