74HC154N,652
vs
MM54HC154J/883C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.3
|
DIP, DIP24,.3
|
| Pin Count |
24
|
|
| Manufacturer Package Code |
SOT101-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
2 ENABLE INPUTS
|
|
| Family |
HC/UH
|
HC
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T24
|
R-GDIP-T24
|
| JESD-609 Code |
e3
|
e0
|
| Length |
31.7 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
4-LINE TO 16-LINE DECODER
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
45 ns
|
|
| Propagation Delay (tpd) |
225 ns
|
220 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.1 mm
|
5.715 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Screening Level |
|
MIL-STD-883 Class C
|
|
|
|
Compare 74HC154N,652 with alternatives
Compare MM54HC154J/883C with alternatives