74HC158D,653
vs
M38510/30904BFA
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SRI INTERNATIONAL
|
Part Package Code |
SOP
|
DFP
|
Package Description |
3.90 MM, PLASTIC, MS-012, SOT-109, SO-16
|
DFP,
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
SOT109-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
HC/UH
|
LS
|
JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
SOP
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
190 ns
|
44 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
2
|
8
|
Package Equivalence Code |
|
FL16,.3
|
Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare 74HC158D,653 with alternatives
Compare M38510/30904BFA with alternatives