74HC1G00GW vs 935262777115 feature comparison

74HC1G00GW NXP Semiconductors

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935262777115 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description PLASTIC, SC-88A, 5 PIN TSSOP,
Pin Count 5 5
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family HC/UH AHC
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 9 1

Compare 74HC1G00GW with alternatives

Compare 935262777115 with alternatives