74HC1G14GW,125
vs
MC74HC1G14DFT2G
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
SOT-353
|
| Package Description |
TSSOP,
|
LEAD FREE, SC-70, SC-88A, SOT-353, 5 PIN
|
| Pin Count |
5
|
5
|
| Manufacturer Package Code |
SOT353-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
6 Weeks
|
|
| Date Of Intro |
1998-08-05
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2.05 mm
|
2 mm
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
190 ns
|
155 ns
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
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