74HC1G32GV,125 vs MC74HC1G32DTT1 feature comparison

74HC1G32GV,125 NXP Semiconductors

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MC74HC1G32DTT1 Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code TSOP
Package Description PLASTIC, SOT-753, SC-74A, 5 PIN TSOP, TSOP5/6,.11,37
Pin Count 5
Manufacturer Package Code SOT753
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e0
Length 2.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.002 A 0.002 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP
Package Equivalence Code TSOP5/6,.11,37 TSOP5/6,.11,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns 35 ns
Propagation Delay (tpd) 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.5 mm
Base Number Matches 2 5
Packing Method TAPE AND REEL
Power Supplies 2/6 V

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