74HC1G32GW,165 vs S-75V32ANC-5V4-T2 feature comparison

74HC1G32GW,165 NXP Semiconductors

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S-75V32ANC-5V4-T2 ABLIC Inc.

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS SEIKO INSTRUMENTS USA INC
Part Package Code TSSOP SOIC
Package Description 1.25 MM, PLASTIC, MO-203, SOT-353, SC-88A, TSSOP-5 TSSOP, TSSOP6,.08
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e0
Length 2.05 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.002 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns 15 ns
Propagation Delay (tpd) 135 ns 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Packing Method TR

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