74HC244D,653 vs MC74HC244ADW feature comparison

74HC244D,653 NXP Semiconductors

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MC74HC244ADW Motorola Mobility LLC

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOP SOIC
Package Description 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 SOP,
Pin Count 20 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Control Type ENABLE LOW
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 33 ns
Propagation Delay (tpd) 165 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 2 5

Compare 74HC244D,653 with alternatives

Compare MC74HC244ADW with alternatives