74HC245D-Q100J
vs
74HC245D
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
TOSHIBA CORP
|
| Part Package Code |
SOP
|
|
| Package Description |
SOP-20
|
SOIC-20
|
| Pin Count |
20
|
|
| Manufacturer Package Code |
SOT163-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
6 Weeks
|
20 Weeks
|
| Date Of Intro |
2017-02-01
|
2016-05-24
|
| Samacsys Manufacturer |
Nexperia
|
Toshiba
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
|
| Length |
12.8 mm
|
12.8 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR, 13 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
135 ns
|
180 ns
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
2.65 mm
|
2.5 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare 74HC245D-Q100J with alternatives
Compare 74HC245D with alternatives